Mfr Part Number |
20-823-90 |
Mfr |
Aries Electronics |
Description |
CONN IC DIP SOCKET 20POS GOLD |
Min Qty |
1 |
Package |
Bulk |
Series |
Vertisocketsâ„¢ 800 |
Product Status |
Active |
Mounting Type |
Through Hole, Right Angle, Horizontal |
Termination |
Solder |
Features |
Closed Frame |
Type |
DIP, 0.3" (7.62mm) Row Spacing |
Operating Temperature |
- |
Housing Material |
Polyamide (PA46), Nylon 4/6 |
Contact Finish Mating |
Gold |
Pitch Mating |
0.100" (2.54mm) |
Contact Finish Thickness Mating |
10.0µin (0.25µm) |
Contact Finish Post |
Gold |
Number Of Positions Or Pins Grid |
20 (2 x 10) |
Contact Material Mating |
Phosphor Bronze |
Pitch Post |
0.100" (2.54mm) |
Contact Finish Thickness Post |
10.0µin (0.25µm) |
Contact Material Post |
Phosphor Bronze |