Manufacturer Omron Electronics Inc-EMC Div
Description CONN IC DIP SOCKET 24POS GOLD
Datasheet Datasheet
Product Attributes
Type Description
Mfr Part Number XR2A-2411-N
Mfr Omron Electronics Inc-EMC Div
Description CONN IC DIP SOCKET 24POS GOLD
Min Qty 1
Package Bulk
Series XR2
Product Status Active
Mounting Type Through Hole
Termination Solder
Features Open Frame
Type DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature -55°C ~ 125°C
Housing Material Polybutylene Terephthalate (PBT), Glass Filled
Contact Finish Mating Gold
Pitch Mating 0.100" (2.54mm)
Contact Finish Thickness Mating 10.0µin (0.25µm)
Contact Finish Post Gold
Number Of Positions Or Pins Grid 24 (2 x 12)
Contact Material Mating Beryllium Copper
Pitch Post 0.100" (2.54mm)
Contact Finish Thickness Post 10.0µin (0.25µm)
Contact Material Post Beryllium Copper
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