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XR2A-0802
| Manufacturer | Omron Electronics Inc-EMC Div |
|---|---|
| Description | CONN IC DIP SOCKET 8POS GOLD |
| Datasheet |
 Datasheet
|
Product Attributes
| Type | Description |
|---|---|
| Mfr Part Number | XR2A-0802 |
| Mfr | Omron Electronics Inc-EMC Div |
| Description | CONN IC DIP SOCKET 8POS GOLD |
| Min Qty | 1 |
| Package | Bulk |
| Series | XR2 |
| Product Status | Active |
| Mounting Type | Through Hole |
| Termination | Wire Wrap |
| Features | Open Frame |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Operating Temperature | -55°C ~ 125°C |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled |
| Contact Finish Mating | Gold |
| Pitch Mating | 0.100" (2.54mm) |
| Contact Finish Thickness Mating | 29.5µin (0.75µm) |
| Contact Finish Post | Gold |
| Number Of Positions Or Pins Grid | 8 (2 x 4) |
| Contact Material Mating | Beryllium Copper |
| Pitch Post | 0.100" (2.54mm) |
| Contact Finish Thickness Post | 29.5µin (0.75µm) |
| Contact Material Post | Beryllium Copper |