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DILB8P-223TLF
| Manufacturer | Amphenol ICC (FCI) |
|---|---|
| Description | CONN IC DIP SOCKET 8POS TIN |
| Datasheet |
 Datasheet
|
Product Attributes
| Type | Description |
|---|---|
| Mfr Part Number | DILB8P-223TLF |
| Mfr | Amphenol ICC (FCI) |
| Description | CONN IC DIP SOCKET 8POS TIN |
| Min Qty | 1 |
| Package | Tube |
| Series | - |
| Product Status | Active |
| Mounting Type | Through Hole |
| Termination | Solder |
| Features | Open Frame |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Operating Temperature | -55°C ~ 105°C |
| Housing Material | Polyamide (PA), Nylon |
| Contact Finish Mating | Tin |
| Pitch Mating | 0.100" (2.54mm) |
| Contact Finish Thickness Mating | 100.0µin (2.54µm) |
| Contact Finish Post | Tin |
| Number Of Positions Or Pins Grid | 8 (2 x 4) |
| Contact Material Mating | Copper Alloy |
| Pitch Post | 0.100" (2.54mm) |
| Contact Finish Thickness Post | 100.0µin (2.54µm) |
| Contact Material Post | Copper Alloy |