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24-6554-16
| Manufacturer | Aries Electronics |
|---|---|
| Description | CONN IC DIP SOCKET ZIF 24POS |
| Datasheet |
 Datasheet
|
Product Attributes
| Type | Description |
|---|---|
| Mfr Part Number | 24-6554-16 |
| Mfr | Aries Electronics |
| Description | CONN IC DIP SOCKET ZIF 24POS |
| Min Qty | 1 |
| Package | Bulk |
| Series | 55 |
| Product Status | Active |
| Mounting Type | Through Hole |
| Termination | Solder |
| Features | Closed Frame |
| Type | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Operating Temperature | - |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Contact Finish Mating | Nickel Boron |
| Pitch Mating | 0.100" (2.54mm) |
| Contact Finish Thickness Mating | 50.0µin (1.27µm) |
| Contact Finish Post | Nickel Boron |
| Number Of Positions Or Pins Grid | 24 (2 x 12) |
| Contact Material Mating | Beryllium Copper |
| Pitch Post | 0.100" (2.54mm) |
| Contact Finish Thickness Post | 50.0µin (1.27µm) |
| Contact Material Post | Beryllium Copper |