| Manufacturer | Analog Devices Inc. |
|---|---|
| Description | 56-BUMP WAFER LEVEL CHIP SCALE P |
| Datasheet |
Datasheet
|
| Type | Description |
|---|---|
| Mfr Part Number | ADAU1860BCBZRL |
| Mfr | Analog Devices Inc. |
| Description | 56-BUMP WAFER LEVEL CHIP SCALE P |
| Min Qty | 1 |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Series | - |
| Product Status | Active |
| Operating Temperature | -40°C ~ 85°C |
| Mounting Type | Surface Mount |
| Package Case | 56-UFBGA, WLCSP |
| Supplier Device Package | 56-WLCSP (2.98x2.68) |
| Type | Audio |
| Resolution Bits | 24 b |
| Data Interface | I²C, I²S, SPI |
| Voltage Supply Analog | 1.7V ~ 1.98V |
| Voltage Supply Digital | 0.85V ~ 1.21V |
| Number Of Adcs Dacs | 3 / 1 |
| Sigma Delta | No |
| S N Ratio Adcs Dacs Db Typ | - |
| Dynamic Range Adcs Dacs Db Typ | 110 / 130 |
Datasheet