Manufacturer Renesas Electronics America Inc
Description SOC PLC MODEM LSI SMART GRID ASS
Datasheet Datasheet
Product Attributes
Type Description
Mfr Part Number R9A06G037GNP#AA0
Mfr Renesas Electronics America Inc
Description SOC PLC MODEM LSI SMART GRID ASS
Min Qty 275
Package Tray
Series -
Product Status Active
Operating Temperature -40°C ~ 85°C (TA)
Package Case 64-VFQFN Exposed Pad
Supplier Device Package 64-HVQFN (9x9)
Architecture DSP, MCU
Core Processor ARM® Cortex®-M3
Ram Size 128KB
Speed 138MHz
Connectivity CSI, I²C, UART
Peripherals PWM
Flash Size -
Primary Attributes -
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